Polymaker PolyMide CoPA
PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
Print Settings
Nozzle Temperature:
250˚C – 270˚C
Printing Speed:
30mm/s – 60mm/s
Bed Temperature:
25˚C – 50˚C
Bed Surface:
Glass with glue
Cooling Fan:
OFF
Based on 0.4 mm nozzle and Simplify 3D v.3.1. Printing conditions may vary with different printers and nozzle diameters
Mechanical Properties
Young’s Modulus:
2223 ± 199 Mpa
Tensile Strength:
66.2 ± 0.9 Mpa
Bending Strength:
97.0 ± 1.1 Mpa
Shore Hardness:
9.6 ± 1.4 kJ/m2
Thermal Properties
Glass Transition Temperature:
67˚C
Vicat Softening Temperature:
180˚C
Melting Temperature:
190°C
Notes
Drying Settings:
100˚C for 8h
Recommended Support Materials:
PolyDissolve™ S1
Other:
It is highly recommended to use the PolyBox™ when printing with PolyMide™ CoPA and to store it in the resealable bag.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 80˚C for 6h
When used extensively, PolyMide CoPA can be abrasive to brass nozzles. When using PolyMide CoPA, we recommend to switch to a wear resistant nozzle such as hardened steel nozzle.
Technology
PolyMide CoPA features Polymaker’s Warp-Free™ technology:
Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.
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